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BAS45AL Datasheet(PDF) 3 Page - NXP Semiconductors |
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BAS45AL Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 1999 May 28 3 Philips Semiconductors Product specification Low-leakage diode BAS45AL ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. THERMAL CHARACTERISTICS Note 1. Device mounted on a FR4 printed-circuit board. SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT VF forward voltage see Fig.3 IF =1mA − 780 mV IF =10mA − 860 mV IF = 100 mA − 1000 mV IR reverse current see Fig.5 VR = 125 V; Emax = 100 lx − 1nA VR = 30 V; Tj = 125 °C; Emax = 100 lx − 300 nA VR = 125 V; Tj = 125 °C; Emax = 100 lx − 500 nA VR = 125 V; Tj = 150 °C; Emax = 100 lx − 2 µA Cd diode capacitance f = 1 MHz; VR = 0; see Fig.6 − 4pF trr reverse recovery time when switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA; see Fig.7 1.5 −µs SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point 300 K/W Rth j-a thermal resistance from junction to ambient note 1 375 K/W |
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