Copyright © 2004, ZMD AG, Rev. 1.6, 2005-05-19

2/19

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ZMD31020

Sensor Signal Conditioner

Datasheet

CONTENT

1.

PIN DESCRIPTION ......................................................................................................................................3

2.

CIRCUIT DESCRIPTION .............................................................................................................................4

2.1 Signal Flow ....................................................................................................................................................4

2.2 Configuration Word........................................................................................................................................5

2.3

Differential Sensor ....................................................................................................................................5

2.4

Temperature Sensing ...............................................................................................................................5

2.5

Analog Input Channel ...............................................................................................................................6

2.5.1

Bridge Polarity Setting .......................................................................................................................6

2.5.2

Programmable Gain Amplifier PGA...................................................................................................6

2.5.3

Analog-to-digital Converter ADC .......................................................................................................6

2.5.4

Temperature Measurement ...............................................................................................................7

2.6

Correction Microcontroller CMC................................................................................................................7

2.7

Parameter EEPROM.................................................................................................................................7

2.8

Sensor Signal Correction Method and Sequence.....................................................................................8

2.9

Digital I

2.9.1

Digital Corrected Sensor Signal Output and I/O for Calibration and Device Test .............................8

2.9.2

Data Communication Specifics..........................................................................................................8

2.10

The Analog Output Stage....................................................................................................................10

3.

ELECTRICAL SPECIFICATION.................................................................................................................10

3.1

Absolute maximum ratings......................................................................................................................10

3.2

Operating Conditions ..............................................................................................................................10

3.3

Electrical Parameters..............................................................................................................................11

3.3.1

Power Supply...................................................................................................................................11

3.3.2

PGA & 12-bit Input ADC ..................................................................................................................11

3.3.3

Temperature Measurement: Current Sources, on-chip Diode & 12-bit ADC

3.3.4

12-bit ADC

3.3.5

EEPROM programming ...................................................................................................................12

3.3.6

Serial I

3.3.7

11-bit Output DAC & Output BUFFER

3.3.8

Total System ....................................................................................................................................14

4.

PACKAGE DIMENSIONS ..........................................................................................................................15

5.

DIE DIMENSIONS AND PAD COORDINATES .........................................................................................16

5.1

Die Dimensions .......................................................................................................................................16

5.2

Pad Coordinates .....................................................................................................................................17

6.

EVALUATION KIT “ZMD31020KIT” ...........................................................................................................18

7.

ORDERING INFORMATION ......................................................................................................................19

8.

RELATED DOCUMENTS...........................................................................................................................19