DS30425 Rev. 5 - 2

1 of 4

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DCX (LO-R1) U

© Diodes Incorporated

DCX (LO-R1) U

DCX (LO-R1) U

COMPLEMENTARY NPN/PNP PRE-BIASED SMALL SIGNAL DUAL SURFACE MOUNT TRANSISTOR

Features

•

Epitaxial Planar Die Construction

•

Built-In Biasing Resistors

•

Lead Free/RoHS Compliant (Note 3)

•

"Green" Device (Note 4 and 5)

Mechanical Data

•

Case: SOT-363

•

Case Material: Molded Plastic. UL Flammability

Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020C

•

Terminals: Finish - Matte Tin Solderable per MIL-STD-

202, Method 208

•

Lead Free Plating (Matte Tin Finish annealed over Alloy

42 leadframe).

•

Terminal Connections: See Diagram

•

Marking Information: See Page 4

•

Type Code: See Table Below

•

Ordering Information: See Page 4

•

Weight: 0.006 grams (approximate)

P/N

R1 (NOM)

R2 (NOM)

Type Code

DCX122LU

DCX142JU

DCX122TU

DCX142TU

0.22K

0.47K

0.22K

0.47K

10K

10K

OPEN

OPEN

C81

C82

C83

C84

SOT-363

Dim

Min

Max

A

0.10

0.30

B

1.15

1.35

C

2.00

2.20

D

0.65 Nominal

F

0.30

0.40

H

1.80

2.20

J

⎯

0.10

K

0.90

1.00

L

0.25

0.40

M

0.10

0.25

α

0

°

8°

All Dimensions in mm

A

M

J

L

D

Maximum Ratings NPN Section

@TA = 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Supply Voltage

VCC

50

V

Input Voltage

DCX122LU

DCX142JU

VIN

-5 to +6

-5 to +6

V

Input Voltage

DCX122TU

DCX142TU

VEBO (MAX)

5

V

Output Current

All

IC

100

mA

Power Dissipation

(Note 1, 2)

Pd

200

mW

Thermal Resistance, Junction to Ambient Air

(Note 2)

RθJA

625

°C/W

Operating and Storage Temperature Range

Tj, TSTG

-55 to +150

°C

Notes:

1. Mounted on FR4 PC Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.

2. 150mW per element must not be exceeded.

3. No purposefully added lead.

4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

R1

R1

R1

R1

R2

R2

B C

H

K

CXX YM

F

R1, R2

R1 Only

SCHEMATIC DIAGRAM