VBP104FAS, VBP104FASR

www.vishay.com

Vishay Semiconductors

Rev. 1.3, 24-Jun-14

7

Document Number: 81169

For technical questions, contact: detectortechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

REEL DIMENSIONS FOR VBP104FAS AND VBP104FASR in millimeters

SOLDER PROFILE

Fig. 8 - Lead (Pb)-free Reflow Solder Profile

acc. J-STD-020

DRYPACK

Devices are packed in moisture barrier bags (MBB) to

prevent the products from moisture absorption during

transportation and storage. Each bag contains a desiccant.

FLOOR LIFE

Time between soldering and removing from MBB must not

exceed the time indicated in J-STD-020:

Moisture sensitivity: level 3

Floor life: 168 h

Conditions: Tamb < 30 °C, RH < 60 %

DRYING

In case of moisture absorption devices should be

baked before soldering. Conditions see J-STD-020 or

recommended conditions:

192 h at 40 °C (+ 5 °C), RH < 5 %

or

96 h at 60 °C (+ 5 °C), RH < 5 %.

21732

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100

150

200

250

300

0

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Time (s)

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. ramp up 3 °C/s max. ramp down 6 °C/s

19841

255 °C