Page 3 of 40

Multi Spider - ORG4572 Datasheet

Revision 3.0

November 23, 2014

17.2.2. GROUND ............................................................................................................................................................. 24

17.3.

RF INPUT ............................................................................................................................................................. 24

17.3.1. PASSIVE ANTENNA.............................................................................................................................................. 24

17.3.2. ACTIVE ANTENNA ............................................................................................................................................... 24

17.4.

CONTROL INTERFACE.......................................................................................................................................... 24

17.4.1. ON_OFF............................................................................................................................................................... 24

17.4.2. WAKEUP.............................................................................................................................................................. 25

17.4.3. RESET .................................................................................................................................................................. 25

17.4.4. 1PPS .................................................................................................................................................................... 25

17.5.

DATA INTERFACE ................................................................................................................................................ 26

17.5.1. UART ................................................................................................................................................................... 26

17.5.2. UART BAUD RATE AND PROTOCOL SELECTION .................................................................................................. 26

17.5.3. SPI ....................................................................................................................................................................... 26

17.5.4. I²C........................................................................................................................................................................ 26

17.6.

SMART SENSORS INTERFACE .............................................................................................................................. 27

17.7.

FLASH MEMORY INTERFACE ............................................................................................................................... 27

17.7.1. DATA LOGGER SUPPORT..................................................................................................................................... 27

17.7.2. AIDING DATA STORAGE SUPPORT ...................................................................................................................... 27

17.7.3. PATCH UPDATE SUPPORT ................................................................................................................................... 27

18.

TYPICAL APPLICATION CIRCUIT........................................................................................................................... 28

18.1.

PASSIVE ANTENNA.............................................................................................................................................. 28

18.2.

ACTIVE ANTENNA ............................................................................................................................................... 28

18.3.

ANTENNA SWITCH .............................................................................................................................................. 28

19.

RECOMMENDED PCB LAYOUT ............................................................................................................................ 29

19.1.

FOOTPRINT ......................................................................................................................................................... 29

19.2.

HOST PCB ............................................................................................................................................................ 30

19.3.

RF TRACE............................................................................................................................................................. 30

19.4.

PCB STACK-UP..................................................................................................................................................... 30

19.5.

PCB LAYOUT RESTRICTIONS ................................................................................................................................ 30

20.

DESIGN CONSIDERATIONS .................................................................................................................................. 31

20.1.

ANTENNA............................................................................................................................................................ 31

20.1.1. PASSIVE ANTENNA.............................................................................................................................................. 31

20.1.2. ACTIVE ANTENNA ............................................................................................................................................... 31

20.2.

RF ........................................................................................................................................................................ 31

21.

OPERATION ......................................................................................................................................................... 31

21.1.

STARTING THE MODULE ..................................................................................................................................... 32

21.2.

AUTONOMOUS POWER ON................................................................................................................................ 33

21.3.

VERIFYING THE MODULE HAS STARTED ............................................................................................................. 33

21.3.1. UART ................................................................................................................................................................... 33

21.3.2. I²C........................................................................................................................................................................ 33

21.3.3. SPI ....................................................................................................................................................................... 33

21.4.

CHANGING PROTOCOL AND BAUD RATE

1 .......................................................................................................... 33

21.5.

CHANGING SATELLITE CONSTELLATION

1 ............................................................................................................ 33

21.6.

SHUTTING DOWN THE MODULE ........................................................................................................................ 33

22.

FIRMWARE.......................................................................................................................................................... 34

22.1.

FIRMWARE UPDATES.......................................................................................................................................... 34

23.

HANDLING INFORMATION.................................................................................................................................. 35

23.1.

MOISTURE SENSITIVITY....................................................................................................................................... 35

23.2.

ASSEMBLY ........................................................................................................................................................... 35

23.3.

SOLDERING ......................................................................................................................................................... 35

23.4.

CLEANING ........................................................................................................................................................... 36

23.5.

REWORK.............................................................................................................................................................. 36

23.6.

ESD SENSITIVITY.................................................................................................................................................. 36

23.7.

SAFETY INFORMATION ....................................................................................................................................... 36

23.8.

DISPOSAL INFORMATION ................................................................................................................................... 36

24.

MECHANICAL SPECIFICATIONS ........................................................................................................................... 37

25.

COMPLIANCE ...................................................................................................................................................... 37

26.

PACKAGING AND DELIVERY ................................................................................................................................ 38