CS2D datasheet(2/4 Pages) VISHAY

2 / 4 page

CS2D, CS2G, CS2J, CS2K, CS2M

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Vishay General Semiconductor

End of Life "August 2021" - Alternative Device "S2D - S2M-E3"

Revision: 01-Mar-2021

Document Number: 87636

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Notes

(1) Pulse test: 300 μs pulse width, 1 % duty cycle

(2) Pulse test: pulse width

≤ 40 ms

Notes

(1) Free air, mounted on recommended copper pad area; thermal resistance RθJA - junction-to-ambient

(2) Mounted on 8 mm x 8 mm copper pad areas, RθJM - junction-to-mount at the terminal

RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)

Fig. 1 - Maximum Forward Current Derating Curve

Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current

ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)

PARAMETER

TEST CONDITIONS

SYMBOL

TYP.

MAX.

UNIT

Maximum instantaneous forward voltage

IF = 1.0 A

TA = 25 °C

VF (1)

0.92

IF = 2.0 A

0.99

1.2

IF = 1.0 A

TA = 125 °C

0.81

IF = 2.0 A

0.90

0.98

Maximum DC reverse current at rated DC

blocking voltage

Rated VR

TA = 25 °C

IR (2)

-5.0

μA

TA = 125 °C

350

Typical reverse recovery time

IF = 0.5 A, IR = 1.0 A,

Irr = 0.25 A

trr

2.1

μs

Typical junction capacitance

4.0 V, 1 MHz

THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)

PARAMETER

SYMBOL

CS2D

CS2G

CS2J

CS2K

CS2M

UNIT

Typical thermal resistance

RθJA

(1)

°C/W

RθJM

(2)

ORDERING INFORMATION (Example)

PREFERRED P/N

UNIT WEIGHT (g)

PREFERRED PACKAGE CODE

BASE QUANTITY

DELIVERY MODE

CS2J-E3/I

0.096

3200

13" diameter plastic tape and reel

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

025

100

125

150

Mount Temperature (

°C)

Rth

JM = 20 C/W, mounted on

8 mm x 8 mm copper pad areas

Rth

JA =97 C/W

0.0

0.4

0.8

1.2

1.6

2.0

2.4

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9

1.1 1.2

Average Forward Current (A)

D = 0.1

D = 0.2

D = 0.3

D = 0.5

D = 1.0

D = 0.8

D = tp/T

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