NXP Semiconductors

FS8600_SDS

Fail-safe system basis chip with multiple SMPSs and LDOs

9 Electrostatic discharge

9.1 Human body model (JESD22/A114)

The device is protected up to ±2 kV, according to the human body model standard with

100 pF and 1.5 kΩ. This protection is ensured at all pins.

9.2 Charged device model

The device is protected up to ±750 V on corner pins and up to ±500 V on all other pins,

according to the AEC Q100 - 011 charged device model standard.

9.3 Discharged contact test

The device is protected up to ±8 kV, according to the following discharged contact tests.

• Discharged contact test (IEC61000-4-2) at 150 pF and 330 Ω

• Discharged contact test (ISO10605.2008) at 150 pF and 2 kΩ

• Discharged contact test (ISO10605.2008) at 330 pF and 2 kΩ

This protection is ensured at VSUP1, VSUP2, WAKE1, WAKE2, FS0B pins.

10 Thermal ratings

Symbol

Description (Rating)

Min

Max

Unit

Thermal ratings

Ambient Temperature (Grade 1)

−40

125

°C

Junction Temperature (Grade 1)

−40

150

°C

Storage Temperature

−55

150

°C

Thermal resistance (per JEDEC JESD51-2 and JESD51-8)

Thermal Resistance Junction to Ambient (2s2p)

—

31

°C/W

Thermal Resistance Junction to Ambient (2s6p)

—

23

°C/W

Thermal Resistance Junction to Board (2s2p)

—

15

°C/W

Thermal Resistance Junction to Board (2s6p)

—

10

°C/W

Thermal Resistance Junction to Case Bottom

(between the die and the solder pad on the bottom of the package)

—

1

°C/W

Thermal Resistance Junction to Package Top (between package top and

the junction temperature)

—

3

°C/W

Table 5. Thermal ratings

11 Revision History

Document ID

Release date

Data sheet status

Change notice

Supersedes

FS8600_SDS v.1.1

20211123

Product

—

—

Modifications:

• Initial Release

Table 6. Revision history

FS8600_SDS

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2021. All rights reserved.

Product short data sheet

Rev. 1.1 — 23 November 2021

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