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ADPA7007 Datasheet(PDF) 1 Page - Analog Devices |
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ADPA7007 Datasheet(HTML) 1 Page - Analog Devices |
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1 / 23 page ![]() 20 GHz to 44 GHz, GaAs, pHEMT, 31.5 dBm (>1 W), MMIC Power Amplifier Data Sheet ADPA7007 Rev. 0 Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibilityisassumedbyAnalogDevicesforitsuse,norforanyinfringementsofpatentsorother rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2020 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com FEATURES Output P1dB: 29 dBm typical at 34 GHz to 44 GHz PSAT: 31.5 dBm typical at 26 GHz to 34 GHz Gain: 20.5 dB typical at 34 GHz to 44 GHz Output IP3: up to 42.5 dBm typical Supply voltage: 5 V at 1400 mA 50 Ω matched input/output 18-terminal, 7 mm × 7 mm LCC_HS package Integrated power detector APPLICATIONS Military and space Test instrumentation Communications FUNCTIONAL BLOCK DIAGRAM 1 VDD1 2 VDD3 3 VDD5 4 VGG1 10 VGG2 11 VDD6 12 VDD4 13 VDD2 ADPA7007 Figure 1. GENERAL DESCRIPTION The ADPA7007 is a gallium arsenide (GaAs), pseudomorphic high electron mobility transfer (pHEMT), monolithic microwave integrated circuit (MMIC), 31.5 dBm saturated output power (>1 W) power amplifier, with an integrated temperature compensated, on-chip power detector that operates between 20 GHz and 44 GHz. The ADPA7007 provides 20.5 dB of small signal gain and approximately 32 dBm of saturated output power at 32 GHz from a 5 V supply (see Figure 26). The ADPA7007 has an output IP3 of 42.5 dBm and is ideal for linear applications such as electronic countermeasure and instrumentation applications requiring >30 dBm of efficient saturated output power. The RF input/outputs are internally matched and dc blocked for ease of integration into higher level assemblies. The ADPA7007 is packaged in a 7 mm × 7 mm, 18-terminal ceramic leadless chip carrier with heat sink (LCC_HS) that exhibits low thermal resistance and is compatible with surface-mount manufacturing techniques. |
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