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Data Sheet

ADP5600

Rev. 0 | Page 19 of 25

THERMAL CONSIDERATIONS

If the ADP5600 junction temperature rises above 150°C, the

internal thermal shutdown circuit turns off the oscillator, charge

pump, and LDO for self protection. Extreme junction temperatures

can be the result of high current operation, poor circuit board

thermal design, and/or high ambient temperature. TSDHYS is

included in the thermal shutdown circuit so that if an overtemper-

ature event occurs, the ADP5600 does not return to normal

operation until the on-chip temperature drops below 135°C.

Upon recovery, both the charge pump and LDO soft starts are

initiated before normal operation begins.

The junction temperature of the ADP5600 can be calculated by

TJ = TA + (PD × θJA)

where:

TA is the ambient temperature.

θJA is the JEDEC thermal resistance.

PD is the power dissipation in the die, given by

PD = ((VIN – VLDO_OUT) × ILDO_OUT) + (VIN × ISW)

where:

VIN and VLDO_OUT are the input and output voltages, respectively.

ILDO_OUT is the LDO load current.

ISW is the active switching current.

Figure 55 shows junction temperature calculations for different

ambient temperatures and power dissipation.

Figure 55. Junction Temperature vs. Total Power Dissipation at Various

Ambient Temperatures

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

TOTAL POWER DISSIPATION (W)

TA = 25°C

TA = 50°C

TA = 85°C

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