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1N5259D Datasheet(PDF) 3 Page - Silicon Supplies

Part # 1N5259D
Description  0.5W Zener Diode
PDF  4 Pages
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Manufacturer  SS [Silicon Supplies]
Direct Link  https://siliconsupplies.com/
Logo SS - Silicon Supplies

1N5259D Datasheet(HTML) 3 Page - Silicon Supplies

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0.5W Zener Diode ‐ 1N52*D series  
Rev 1.1
05/04/19
Electrical Characteristics T
A = 25°C unless otherwise stated
ZENER VOLTAGE
RANGE
 
TEST
CURRENT
 
REVERSE
LEAKAGE
CURRENT
 
DYNAMIC RESISTANCE
 
TEMP.
COEFFICIENT
IR @ VR
 
ZZ @ IZT1
 
ZZK @ IZT2
 
VZ @ IZT1
 
IZT2
 
IZT2
 
TA = 25°C
f = 1 kHz
 
α VZ
 
V
 
µA
 
Ω
 
%/K
 
DEVICE
 
 
Min.
 
Nom.
 
Max.
 
mA
 
Max.
V
 
Max.
Max.
 
Typ.
1N5245D
14.85
15
15.15
8.5
0.25
0.1
11
19
600
0.082
1N5246D
15.84
16
16.16
7.8
0.25
0.1
12
21
600
0.083
1N5247D
16.83
17
17.17
7.4
0.25
0.1
13
23
600
0.084
1N5248D
17.82
18
18.18
7
0.25
0.1
14
25
600
0.085
1N5249D
18.81
19
19.19
6.6
0.25
0.1
14
29
600
0.086
1N5250D
19.80
20
20.20
6.2
0.25
0.1
15
33
600
0.086
1N5251D
21.78
22
22.22
5.6
0.25
0.1
17
35
600
0.087
1N5252D
23.76
24
24.24
5.2
0.25
0.1
18
41
600
0.088
1N5253D
24.75
25
25.25
5
0.25
0.1
19
44
600
0.089
1N5254D
26.73
27
27.27
4.6
0.25
0.1
21
49
600
0.09
1N5255D
27.72
28
28.28
4.5
0.25
0.1
21
58
600
0.091
1N5256D
29.70
30
30.30
4.2
0.25
0.1
23
70
600
0.091
1N5257D
32.67
33
33.33
3.8
0.25
0.1
25
80
700
0.092
1N5258D
35.64
36
36.36
3.4
0.25
0.1
27
93
700
0.093
1N5259D
38.61
39
39.39
3.2
0.25
0.1
30
105
800
0.094
1N5260D
42.57
43
43.43
3
0.25
0.1
33
125
900
0.095
1N5261D
46.53
47
47.47
2.7
0.25
0.1
36
150
1000
0.095
1N5262D
50.49
51
51.51
2.5
0.25
0.1
39
170
1100
0.096
1N5263D
55.44
56
56.56
2.2
0.25
0.1
43
185
1300
0.096
1N5264D
59.40
60
60.60
2.1
0.25
0.1
46
230
1400
0.097
1N5265D
61.38
62
62.62
2
0.25
0.1
47
270
1400
0.097
1N5266D
67.32
68
68.68
1.8
0.25
0.1
52
330
1600
0.097
1N5267D
74.25
75
75.75
1.7
0.25
0.1
56
370
1700
0.098
 
1. Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings, for extended periods,
may reduce device reliability.
2. Assembled in DO-35 package. Performance in die form subject to assembly heat sinking and die attach methods.



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