AD8376ACPZ-R7 datasheet(23/24 Pages) AD

23 / 24 page

Data Sheet

AD8376

Rev. B | Page 23 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

3.25

3.10 SQ

2.95

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

Figure 52. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-7)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD8376ACPZ-WP

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] , Waffle Pack

CP-32-7

AD8376ACPZ-R7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ], 7”Tape and Reel

CP-32-7

AD8376-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

AD8376ACPZ-R7 Datasheet(PDF) 23 Page - Analog Devices

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