AD8134ACPZ-R2 datasheet(19/20 Pages) AD

19 / 20 page

Data Sheet

AD8134

Rev. B | Page 19 of 20

LAYOUT AND POWER SUPPLY DECOUPLING

CONSIDERATIONS

Standard high speed PCB layout practices should be adhered to

when designing with the AD8134. A solid ground plane is

recommended and good wideband power supply decoupling

networks should be placed as close as possible to the supply

pins. Small surface-mount ceramic capacitors are recommended

for these networks, and tantalum capacitors are recommended

for bulk supply decoupling.

AMPLIFIER-TO-AMPLIFIER ISOLATION

The least amount of isolation between the three amplifiers

exists between Amplifier R and Amplifier G. This is therefore

viewed as the worst-case isolation and is what is reflected in the

Specifications tables and Typical Performance Characteristics.

Refer to the basic test circuit in Figure 5 for test conditions.

EXPOSED PADDLE (EP)

The 24-lead LFCSP package has an exposed paddle on the

underside of its body. To achieve the specified thermal resistance,

it must have a good thermal connection to one of the PCB planes.

The exposed paddle must be soldered to a pad on top of the

board that is connected to an inner plane with several thermal

vias.

AD8134ACPZ-R2 Datasheet(PDF) 19 Page - Analog Devices