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MAT02 Datasheet(PDF) 1 Page - Analog Devices |
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MAT02 Datasheet(HTML) 1 Page - Analog Devices |
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1 / 6 page ![]() Low-noise, matched dual monolithic transistor MAT02 1.0 SCOPE This specification documents the detail requirements for space qualified product manufactured on Analog Devices, Inc.'s QML certified line per MIL-PRF-38535 Level V except as modified herein. The manufacturing flow described in the STANDARD SPACE LEVEL PRODUCTS PROGRAM brochure is to be considered a part of this specification http://www.analog.com/aerospace This data sheet specifically details the space grade version of this product. A more detailed operational description and a complete datasheet for commercial product grades can be found at www.analog.com/MAT02 2.0 Part Number. The complete part number(s) of this specification follow: Part Number Description MAT02-903H Low-noise, matched dual monolithic transistor 2.1 Case Outline. Letter Descriptive designator Case Outline (Lead Finish per MIL-PRF-38535) H MACY1-X6 6-Lead can package (TO) Figure 1 - Terminal connections. 3.0 Absolute Maximum Ratings. (TA = 25°C, unless otherwise noted) Collector to base voltage (BVCBO) ..................................................................................40V Collector to emitter voltage (BVCEO)..............................................................................40V Collector to collector voltage (BVCC) .............................................................................40V Emitter to emitter voltage (BVEE)...................................................................................40V Collector current (IC)....................................................................................................20mA Emitter current (IE).......................................................................................................20mA Total power dissipation 1/........................................................................................500mW Operating ambient temperature range.............................................................-55 to +125°C Storage temperature range ......................................................................... -65°C to +150°C Lead temperature (soldering, 60 sec)........................................................................ +300°C Dice junction temperature......................................................................................... +150°C 1/ Rating applies to applications not using heat sinking, device is free air only. |
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