KRTBHDLP71.32 datasheet(21/28 Pages) OSRAM

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KRTBHDLP71.32 Datasheet(PDF) 21 Page - OSRAM GmbH

21 / 28 page

KRTB HDLP71.32

2017-07-04

Empfohlenes Lötpaddesign

7) Seite 28

Reflow Löten

Recommended Solder Pad

7) page 28

Reflow Soldering

Note:

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere.

Package not suitable for ultrasonic cleaning.

Anm.:

Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter

Standard-Stickstoffatmosphäre zu löten.

Das Gehäuse ist nicht für Ultraschallreinigung geeignet.

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