PCF2113EU2 datasheet(7/72 Pages) PHILIPS

7 / 72 page

2001 Dec 19

Philips Semiconductors

Product speciﬁcation

LCD controllers/drivers

PCF2113x

Notes

1. Bonding pad location information is given in Chapter 17.

2. When the on-chip oscillator is used this pad must be connected to VDD1.

3. In the LQFP100 version this signal is connected internally and can not be accessed at any pin.

4. When the I2C-bus is used, the parallel interface pin E must be LOW. In the I2C-bus read mode DB7 to DB0 should

be connected to VDD1 or left open-circuit.

When the parallel bus is used, the pins SCL and SDA must be connected to VSS1 or VDD1; they must not be left

open-circuit.

When the 4-bit interface is used without reading out from the PCF2113x (R/W is set permanently to logic 0), the

unused ports DB0 to DB4 can either be set to VSS1 or VDD1 instead of leaving them open-circuit.

5. DB7 may be used as the busy flag, signalling that internal operations are not yet completed. In 4-bit operations the

four higher order lines DB7 to DB4 are used; DB3 to DB0 must be left open-circuit except for I2C-bus operations

(see note 4).

6. VDD2 and VDD3 should always be equal.

7. When VLCD is generated internally, pins VLCD1, VLCD2 and VLCDSENSE must be connected together. When external

VLCD is supplied, pin VLCD2 should be left open-circuit to avoid any stray current, pins VLCD1 and VLCDSENSE must be

connected together.

DB0

108

I/O

8-bit bidirectional data bus bit 0

VDD2

100

109

supply voltage 2 for VLCD generator; note 6

VDD3

−

110

supply voltage 3 for VLCD generator; notes 3 and 6

SYMBOL

PCF2113DH

PAD(1)

PCF2113XU

TYPE

DESCRIPTION

PCF2113EU2 Datasheet(PDF) 7 Page - NXP Semiconductors