| Manufacturer | Part # | Datasheet | Description |
 Hirose Electric |
DF30CJ-22DS
|
865Kb / 11P |
0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors
|
 Aries Electronics, Inc. |
24-651000-10
|
499Kb / 1P |
36-Pin SSOP-to-0.6 DIP Adapter
|
 Hirose Electric |
DF24A-40DS-0.9C
|
419Kb / 8P |
0.9 mm Pitch Vertical Mating Board-to-Wire Connectors
|
 NXP Semiconductors |
SOT926-1
|
239Kb / 1P |
plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
2009 |
 ILSI America LLC |
I523
|
43Kb / 1P |
Surface Mount Oscillator, TCXO, TCVCXO Metal Package, 9 mm x 11 mm
|
|
I525
|
44Kb / 1P |
Surface Mount Oscillator, TCXO, TCVCXO Metal Package, 9 mm x 11 mm
|
 Hirose Electric |
DF24
|
427Kb / 8P |
0.9 mm Pitch Vertical Mating Board-to-Wire Connectors
|
|
FH19C
|
348Kb / 12P |
0.5 mm Pitch, 0.9 mm Height, FPC/FFC Connectors
|
 NXP Semiconductors |
NAFE11388
|
226Kb / 7P |
thermal enhanced very thin quad flat package, no leads, dimple wettable flank; 64 terminals, 0.5 mm pitch, 9 mm x 9 mm x 0.85 mm body
Rev. 1-29 December 2021 |
 FIBOX Enclosing innovat... |
4712052
|
46Kb / 1P |
Spacer 42 mm
26.07.2023 |