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MLL3017B Datasheet (PDF) - Microsemi Corporation

MLL3017B Datasheet PDF - Microsemi Corporation
Part # MLL3017B
Download  MLL3017B Download

File Size   99.91 Kbytes
Page   2 Pages
Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation
Description LEADLESS GLASS ZENER DIODES

MLL3017B Datasheet (PDF)

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MLL3017B Datasheet PDF - Microsemi Corporation

Part # MLL3017B
Download  MLL3017B Click to download

File Size   99.91 Kbytes
Page   2 Pages
Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation
Description LEADLESS GLASS ZENER DIODES

MLL3017B Datasheet (HTML) - Microsemi Corporation

MLL3017B Datasheet HTML 1Page - Microsemi Corporation MLL3017B Datasheet HTML 2Page - Microsemi Corporation

MLL3017B Product details

DESCRIPTION

This surface mountable zener diode seriesis similar to the 1N3016 thru 1N3051 JEDEC registrationin the DO-13 package except that it meets the surface mount DO-213AB outline. It is an ideal selection for applications of high density and low parasitic requirements. Due to its glass hermetic seal

qualities andmetallurgically enhanced internal construction, it is also well suited for high-reliability applications.



FEATURES

•  Leadless surface mount package equivalents to the JEDEC registered 1N3016 thru1N3051except with higher power rating of 1.5 Watts

•  Ideal for high-density mounting

•  Voltage range: 6.8 to 200 volts

•  Hermetically sealed, double-slug glass construction

•  Metallurgically enhanced contact construction.

•  Options for screening inaccordance with MIL-PRF-19500/115 for JAN, JANTX, JANTXV, and JANS

with MQ, MX, MV, or MSP prefixes respectively for part numbers, e.g. MX1N3016BUR-1,

MV1N3051BUR-1, etc.

•  Axial lead “thru-hole” DO-13 packages per JEDEC registration available as 1N3016B thru 1N3051B (see separate data sheet withMIL-PRF-19500/115 qualification)



APPLICATIONS/ BENEFITS

•  Regulates voltage over a broad operating current and temperature range

•  Wide selection from 6.8 to 200V

•  Tight voltage tolerances available

•  Lowreverse (leakage) currents

•  Leadless package for surfacemounting

•  Ideal for high-density mounting

•  Metallurgically enhanced internal contact design for greater reliabilityand lower thermal resistance

•  Nonsensitive to ESD

•  Hermetically sealed glass package

•  Specified capacitance (seeFigure 2)

•  Inherentlyradiation hard as described in Microsemi MicroNote 050




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About Microsemi Corporation


Microsemi Corporation was an American company that specialized in the design and manufacture of semiconductor and system solutions.
The company was founded in 1960 and was headquartered in Aliso Viejo, California.
Microsemi provided a wide range of products including analog and mixed-signal integrated circuits, field-programmable gate arrays (FPGAs), power management and control products, and other semiconductor solutions.
The company's products were used in various applications such as defense and security, aerospace and aviation, industrial, and communications.
Microsemi was known for its expertise in semiconductor technology and its ability to deliver high-quality and reliable products to its customers.
In 2018, Microsemi was acquired by Microchip Technology, a leading provider of microcontroller, mixed-signal, analog, and security products.
The Microsemi brand is no longer in use, but its technology and products continue to be a part of Microchip's portfolio.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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