Manufacturer | Part # | Datasheet | Description |
 STMicroelectronics |
AN1235
|
257Kb / 14P |
package description and recommendations for use
|
AN4208
|
288Kb / 16P |
package description and recommendations for use
|
AN2348
|
267Kb / 17P |
package description and recommendations for use
|
TN1163
|
651Kb / 21P |
Description of WLCSP for microcontrollers and recommendations for use
|
TN0991
|
727Kb / 21P |
Description of WLCSP for STMicroelectronics EEPROMs and recommendations for use
|
TN1171
|
580Kb / 26P |
Description of UFDFPN5, UFDFPN8 and WFDFPN8 for STMicroelectronics EEPROMs and recommendations for use
|
AN2639
|
522Kb / 15P |
Soldering recommendations and package information for Lead-free ECOPACK microcontrollers
|
 Motorola, Inc |
AN1580
|
126Kb / 4P |
MOUNTING AND SOLDERING RECOMMENDATIONS FOR THE MOTOROLA POWER FLAT PACK PACKAGE
|
 Alpha & Omega Semicondu... |
AO3410
|
110Kb / 1P |
PACKAGE MARKING DESCRIPTION
|
AOTF472
|
117Kb / 1P |
PACKAGE MARKING DESCRIPTION
|