| Manufacturer | Part # | Datasheet | Description |
 Aries Electronics, Inc. |
24-651000-10
|
499Kb / 1P |
36-Pin SSOP-to-0.6 DIP Adapter
|
 OSRAM GmbH |
LSQ976-NR-1
|
460Kb / 20P |
SMT package 0603, colorless diffused resin, 1.6 mm x 0.8 mm x 0.8 mm
|
 Bel Fuse Inc. |
XRBH-03HXX0
|
1,016Kb / 12P |
9 VDC ??36 VDC Input
|
 OSRAM GmbH |
LO-Q976
|
528Kb / 20P |
SMT package 0603, colorless diffused resin, 1.6 mm x 0.8 mm x 0.8 mm
|
|
LS-Q976
|
517Kb / 19P |
SMT package 0603, colorless diffused resin, 1.6 mm x 0.8 mm x 0.8 mm
|
|
LG-Q971
|
418Kb / 21P |
SMT package 0603, colorless diffused resin, 1.6 mm x 0.8 mm x 0.8 mm
|
|
LS-Q971
|
211Kb / 20P |
SMT package 0603, colorless diffused resin, 1.6 mm x 0.8 mm x 0.8 mm
|
|
LY-Q971
|
211Kb / 20P |
SMT package 0603, colorless diffused resin, 1.6 mm x 0.8 mm x 0.8 mm
|
|
LY-Q976
|
242Kb / 20P |
SMT package 0603, colorless diffused resin, 1.6 mm x 0.8 mm x 0.8 mm
|
 NXP Semiconductors |
NAFE11388
|
226Kb / 7P |
thermal enhanced very thin quad flat package, no leads, dimple wettable flank; 64 terminals, 0.5 mm pitch, 9 mm x 9 mm x 0.85 mm body
Rev. 1-29 December 2021 |