1FEATURES
2• Very Low Total Quiescent Current:
3.5 mA at 3 V
• Disabled Supply Current: 0.15 μA
• Third-Order Butterworth Low-Pass Filters:
– –1 dB at 17 MHz
– –3 dB at 20 MHz
– Attenuation: 21 dB at 43 MHz
– Supports Y’P’BP’R 480p/576p or
R’G’B’ Video third–
Supports Oversampled Systems
Generating CVBS, S-Video, or
Y’P’BP’R 480i/576i
• DC-Coupled Input with 150-mV Output Shift
• Built-In Gain: 4 V/V (12 dB)
• Single-Supply Operation: +2.6 V to +5 V
• Rail-to-Rail Output Supports
AC- or DC-Coupling
• Low Differential Gain/Phase: 0.1%/0.1°
• Output Pins Support ±8-kV IEC ESD Protection
• Ultra Small, WCSP 9-Ball Package:
– Tiny PCB Area: 0.96 mm x 0.96 mm (Typ)
– Very Low Profile Height: 0.5 mm (Max)
– Pitch: 0.3 mm

APPLICATIONS
• Personal Media Players
• Digital Cameras
• Cellular Phone Video Output Buffering

DESCRIPTION
Fabricated using the revolutionary, complementary
Silicon-Germanium (SiGe) BiCom-3X process, the
THS7320 is a very low power, single-supply, 2.6-V to
5-V, three-channel integrated video buffer with a gain
of 4 V/V. This device is ideal for battery-powered
applications where size and power are critical
parameters. The total quiescent current is only 3.5
mA at 3 V and the video portion can be reduced
down to 0.15 μA while disabled.
The THS7320 video section incorporates three
enhanced definition (ED) filter channels with third–
order Butterworth characteristics. These filters are
useful as digital-to-analog converter (DAC)
reconstruction filters or as analog-to-digital converter
(ADC) antialiasing filters. The THS7320 is also ideal
for oversampled systems that produce standard
definition (SD) signals including CVBS, S-Video,
480i/576iY’P’BP’R, Y’U’V’, and R’G’B’.
The THS7320 is designed for dc-coupled inputs. To
mitigate any DAC/encoder termination interaction, the
input impedance is a very high 2.4 MΩ. The internal
level shift adds 150-mV offset at the output to
eliminate saturation or clipping concerns. The rail-to-
rail output supports either dc- or ac- coupling.
The THS7320 is available in an ultra small, 9-ball
wafer chip-scale package (WCSP) package that
requires an ultra small, 0.92-mm2 (typ) printed circuit
board (PCB) area.