PRODUCT DESCRIPTION
Chem-Wik Rosin is especially designed for today’s heat sensitive electronic components. The lighter mass, pure copper braid construction allows for better thermal conductivity, even at low temperatures. Chem-Wik Rosin responds as much as 50% faster than conventional desoldering braids. This design minimizes overheating and requires less “contact” pressure for greater operator control. All sizes are coated with a Type “R” organic flux system.
 Requires little or no post solder cleaning
 No corrosive residues
 Optimized weave design for faster wicking and heat transfer
 Halide free
 Minimal risk of heat damage to components and circuit boards

TYPICAL APPLICATIONS
Chem-Wik Rosin desoldering braid safely removes solder from:
 Thru-hole Components
 Surface Mount Device Pads
 BGA Pads
 Micro Circuits
 Terminals
 Lugs and Posts
 Identification Script