PDIP Datasheet(PDF) - Amkor Technology

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PDIP Datasheet (PDF) - Amkor Technology

PDIP Datasheet PDF - Amkor Technology


Part #	PDIP

Download	PDIP Download

File Size	393.79 Kbytes

Page	2 Pages

Manufacturer	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

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Description

Amkor?셲 PDIP packages offer

PDIP Datasheet (PDF)

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PDIP Datasheet PDF - Amkor Technology


Part #	PDIP

Download	PDIP Click to download

File Size	393.79 Kbytes

Page	2 Pages

Manufacturer	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

Logo

Description	Amkor?셲 PDIP packages offer

PDIP Datasheet (HTML) - Amkor Technology

PDIP Datasheet HTML 1Page - Amkor Technology

PDIP Datasheet HTML 2Page - Amkor Technology

Similar Part No. - PDIP

Manufacturer	Part #	Datasheet	Description
Analog Microelectronics	PDIP-40	53Kb / 1P	A : MIN 3.300 MAX 4.200 B : MIN 0.018 MAX 0.570
Analog Microelectronics	PDIP-8	53Kb / 1P	A : MIN 0.13 MAX - B : MIN 6.10 MAX 7.10
STMicroelectronics	PDIP24	32Kb / 2P	POWER DIP 24 2022 leads

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About Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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