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LPC55S04JBD64 Datasheet (PDF) - NXP Semiconductors

LPC55S04JBD64 Datasheet PDF - NXP Semiconductors
Part # LPC55S04JBD64
Download  LPC55S04JBD64 Download
File Size   2579.24 Kbytes
Page   119 Pages
Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Description 32-bit Arm Cortex®-M33, TrustZone, PRINCE, CASPER, 96 KB SRAM; 256 KB flash, Flexcomm Interface, CAN FD, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 2.0 Msamples/sec ADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG

LPC55S04JBD64 Datasheet (PDF)

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LPC55S04JBD64 Datasheet PDF - NXP Semiconductors

Part # LPC55S04JBD64
Download  LPC55S04JBD64 Click to download

File Size   2579.24 Kbytes
Page   119 Pages
Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors
Description 32-bit Arm Cortex®-M33, TrustZone, PRINCE, CASPER, 96 KB SRAM; 256 KB flash, Flexcomm Interface, CAN FD, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 2.0 Msamples/sec ADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG

LPC55S04JBD64 Datasheet (HTML) - NXP Semiconductors


LPC55S04JBD64 Product details

General description
The LPC55S0x/LPC550x is an ARM Cortex-M33 based microcontroller for embedded
applications. These devices include CASPER Crypto engine, up to 256 KB on-chip flash,
up to 96 KB of on-chip SRAM, PRINCE module for on-the-fly flash encryption/decryption,
Code Watchdog, CAN FD, five general-purpose timers, one SCTimer/PWM, one
RTC/alarm timer, one 24-bit Multi-Rate Timer (MRT), a Windowed Watchdog Timer
(WWDT), nine flexible serial communication peripherals (which can be configured as a
USART, SPI, high speed SPI, I2C, or I2S interface), Programmable Logic Unit (PLU), one
16-bit 2.0 Msamples/sec ADC capable of simultaneous conversions, comparator, and
temperature sensor.
The ARM Cortex-M33 provides a security foundation, offering isolation to protect valuable
IP and data with TrustZone® technology. It simplifies the design and software
development of digital signal control systems with the integrated digital signal processing
(DSP) instructions. To support security requirements, the LPC55S0x/LPC550x also offers
support for secure boot, HASH, AES, RSA, UUID, DICE, dynamic encrypt and decrypt,
debug authentication, and TBSA compliance.

Features and benefits
 ARM Cortex-M33 core (r0p4):
 Running at a frequency of up to 96 MHz.
 Integrated digital signal processing (DSP) instructions.
 TrustZone®, Floating Point Unit (FPU) and Memory Protection Unit (MPU).
 ARM Cortex M33 built-in Nested Vectored Interrupt Controller (NVIC).
 Non-maskable Interrupt (NMI) input with a selection of sources.
 Serial Wire Debug with eight breakpoints and four watch points. Includes Serial
Wire Output for enhanced debug capabilities.
 System tick timer.
 CASPER Crypto co-processor is provided to enable hardware acceleration for various
functions required for certain asymmetric cryptographic algorithms, such as, Elliptic
Curve Cryptography (ECC).
 On-chip memory:
 Up to 256 KB on-chip flash program memory with flash accelerator and 512 byte
page erase and write.
 Up to 96 KB total SRAM consisting of 16 KB SRAM on Code Bus, 64 KB SRAM on
System Bus (64 KB is contiguous), and additional 16 KB SRAM on System Bus.
 PRINCE module for real-time encryption of data being written to on-chip flash and
decryption of encrypted flash data during read to allow asset protection, such as
securing application code, and enabling secure flash update.
 On-chip ROM bootloader supports:
 Booting of images from on-chip flash
 Supports CRC32 image integrity checking.
 Supports flash programming through In System Programming (ISP) commands
over following interfaces: UART interface (Flexcomm 0) with auto baud, SPI slave
interfaces (Flexcomm 3 or 8) using mode 3 (CPOL = 1 and CPHA = 1), and I2C
slave interface (Flexcomm 1)
 ROM API functions: Flash programming API, Power control API, and Secure
firmware update API using NXP Secure Boot file format, version 2.0 (SB2 files).
 Supports booting of images from PRINCE encrypted flash regions.
 Support NXP Debug Authentication Protocol version 1.0 (RSA-2048) and 1.1
(RSA-4096).
 Supports setting a sealed part to Fault Analysis mode through Debug
authentication.
 Secure Boot support:
 Uses RSASSA-PKCS1-v1_5 signature of SHA256 digest as cryptographic
signature verification.
 Supports RSA-2048 bit public keys (2048 bit modulus, 32-bit exponent).
 Supports RSA-4096 bit public keys (4096 bit modulus, 32-bit exponent).
 Uses x509 certificate format to validate image public keys.
 Supports up to four revocable Root of Trust (RoT) or Certificate Authority keys,
Root of Trust establishment by storing the SHA-256 hash digest of the hashes of
four RoT public keys in protected flash region (PFR).
 Supports anti-rollback feature using image key revocation and supports up to 16
Image key certificates revocations using Serial Number field in x509 certificate.
 Supports Device Identifier Composition Engine (DICE) Specification (version
Family 2.0, Level 00 Revision 69) specified by Trusted Computing Group.
 Serial interfaces:
 Flexcomm Interface contains up to nine serial peripherals (Flexcomm Interface 0-7
and Flexcomm Interface 8). Each Flexcomm Interface (except flexcomm 8, which
is dedicated for high-speed SPI) can be selected by software to be a USART, SPI,
I2C, and I2S interface. Each Flexcomm Interface includes a FIFO that supports
USART, SPI, and I2S. A variety of clocking options are available to each Flexcomm
Interface, including a shared fractional baud-rate generator, and time-out
feature.Flexcomm interfaces 0 to 5 each provide one channel pair of I2S and
Flexcomm interfaces 6 to 7 each provide four channel pairs of I2S.
 I2C-bus interfaces support Fast-mode and Fast-mode Plus with data rates of up to
1Mbit/s and with multiple address recognition and monitor mode. Two sets of true
I2C pads also support high-speed Mode (3.4 Mbit/s) as a slave.
 Digital peripherals:
 DMA0 controller with 23 channels and up to 22 programmable triggers, able to
access all memories and DMA-capable peripherals.
 DMA1 controller with 10 channels and up to 15 programmable triggers, able to
access all memories and DMA-capable peripherals.
 CAN FD module with dedicated DMA controller
 CRC engine block can calculate a CRC on supplied data using one of three
standard polynomials with DMA support.
 Up to 45 General-Purpose Input/Output (GPIO) pins.
 GPIO registers are located on the AHB for fast access. The DMA supports GPIO
ports.
 Up to eight GPIOs can be selected as pin interrupts (PINT), triggered by rising,
falling or both input edges.
 Two GPIO grouped interrupts (GINT) enable an interrupt based on a logical
(AND/OR) combination of input states.
 I/O pin configuration with support for up to 16 function options.
 Programmable Logic Unit (PLU) to create small combinatorial and/or sequential
logic networks including state machines.
 Security Features:
 ARM TrustZone® enabled.
 AES-256 encryption/decryption engine with keys fed directly from PUF or a
software supplied key
 Secure Hash Algorithm (SHA2) module supports secure boot with dedicated DMA
controller.
 Physical Unclonable Function (PUF) using dedicated SRAM for silicon fingerprint.
PUF can generate, store, and reconstruct key sizes from 64 to 4096 bits. Includes
hardware for key extraction.
 True Random Number Generator (TRNG).
 128 bit unique device serial number for identification (UUID).
 Secure GPIO.
 Code Watchdog for detecting code flow integrity.
 Timers:
 Five 32-bit standard general purpose asynchronous timers/counters, which support
up to four capture inputs and four compare outputs, PWM mode, and external
count input. Specific timer events can be selected to generate DMA requests.
 One SCTimer/PWM with 8 input and 10 output functions (including 16 capture and
match registers). Inputs and outputs can be routed to or from external pins and
internally to or from selected peripherals. Internally, the SCTimer/PWM supports 16
captures/matches, 16 events, and 32 states.
 32-bit Real-time clock (RTC) with 1 s resolution running in the always-on power
domain. Another timer in the RTC can be used for wake-up from all low power
modes including deep power-down, with 1 ms resolution. The RTC is clocked by
the 32 kHz FRO or 32.768 kHz external crystal.
 Multiple-channel multi-rate 24-bit timer (MRT) for repetitive interrupt generation at
up to four programmable, fixed rates.
 Windowed Watchdog Timer (WWDT) with FRO 1 MHz as clock source.
 Code Watchdog for detecting code flow integrity.
 The Micro-Tick Timer running from the watchdog oscillator can be used to wake-up
the device from sleep and deep-sleep modes. Includes 4 capture registers with pin
inputs.
 42-bit free running OS Timer as continuous time-base for the system, available in
any reduced power modes. It runs on 32 kHz clock source, allowing a count period
of more than 4 years.
 Analog peripherals:
 16-bit ADC with five differential channel pair (or 10 single-ended channels), and
with multiple internal and external trigger inputs and sample rates of up to 2.0
MSamples/sec. The ADC support simultaneous conversions, on 2 ADC input
channels belonging to a differential pair.
 Integrated temperature sensor connected to the ADC.
 Comparator with five input pins and external or internal reference voltage.
 Clock generation:
 Internal Free Running Oscillator (FRO). This oscillator provides a selectable 96
MHz output, and a 12 MHz output (divided down from the selected higher
frequency) that can be used as a system clock. The FRO is trimmed to +/- 1%
accuracy over the entire voltage and 0 C to 85 C. The FRO is trimmed to +/- 2%
accuracy over the entire voltage and -40 C to 105 C.
 32 kHz Internal Free Running Oscillator FRO. The FRO is trimmed to +/- 2%
accuracy over the entire voltage and temperature range.
 Internal low power oscillator (FRO 1 MHz) trimmed to +/- 15% accuracy over the
entire voltage and temperature range.
 Crystal oscillator with an operating frequency of 16 MHz to 32 MHz. Option for
external clock input (bypass mode) for clock frequencies of up to 25 MHz.
 Crystal oscillator with 32.768 kHz operating frequency.
 PLL0 and PLL1 allows CPU operation up to the maximum CPU rate without the
need for a high-frequency external clock. PLL0 and PLL1 can run from the internal
FRO 12 MHz output, the external oscillator, internal FRO 1 MHz output, or the
32.768 kHz RTC oscillator.
 Clock output function with divider to monitor internal clocks.
 Frequency measurement unit for measuring the frequency of any on-chip or
off-chip clock signal.
 Each crystal oscillator has one embedded capacitor bank, where each can be used
as an integrated load capacitor for the crystal oscillators. Using APIs, the capacitor
banks on each crystal pin can tune the frequency for crystals with a Capacitive
Load (CL) leading to conserving board space and reducing costs.
 Power-saving modes and wake-up:
 Integrated PMU (Power Management Unit) to minimize power consumption.
 Reduced power modes: Sleep, deep-sleep with RAM retention, power-down with
RAM retention and CPU retention, and deep power-down with RAM retention.
 Configurable wake-up options from peripherals interrupts.
 The Micro-Tick Timer running from the watchdog oscillator, and the Real-Time
Clock (RTC) running from the 32.768 kHz clock, can be used to wake-up the
device from sleep and deep-sleep modes.
 Power-On Reset (POR) (around 0.8 V).
 Brown-Out Detectors (BOD) for VBAT_DCDC with separate thresholds for forced reset.
 Operating from internal DC-DC converter.
 Single power supply 1.8 V to 3.6 V.
 JTAG boundary scan supported.
 Operating temperature range 40 °C to +105 °C.
 Available in HTQFP64 and HVQFN48 packages.




Similar Part No. - LPC55S04JBD64

ManufacturerPart #DatasheetDescription
logo
NXP Semiconductors
LPC55S04JBD64 NXP-LPC55S04JBD64 Datasheet
3Mb / 116P
32-bit Arm Cortex짰-M33, TrustZone, PRINCE, CASPER, 96 KB SRAM; 256 KB flash, Flexcomm Interface, CAN FD, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 2.0 Msamples/sec ADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG
Rev. 1.0-16 October 2020
LPC55S04JBD64 NXP-LPC55S04JBD64 Datasheet
2Mb / 118P
32-bit Arm Cortex짰-M33, TrustZone, PRINCE, CASPER, 96 KB SRAM; 256 KB flash, Flexcomm Interface, CAN FD, 32-bitcounter/ timers, SCTimer/PWM, PLU, 16-bit 2.0 Msamples/secADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC,RNG
Rev. 1.2-6 August 2021
LPC55S04JBD64 NXP-LPC55S04JBD64 Datasheet
2Mb / 119P
32-bit Arm Cortex®-M33, TrustZone, PRINCE, CASPER, 96 KB SRAM; 256 KB flash, Flexcomm Interface, CAN FD, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 2.0 Msamples/sec ADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG
Rev. 1.3 - 3 February 2023
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Similar Description - LPC55S04JBD64

ManufacturerPart #DatasheetDescription
logo
NXP Semiconductors
LPC55S6X NXP-LPC55S6X Datasheet
4Mb / 128P
32-bit Arm Cortex짰-M33; M33 coprocessor, TrustZone, PowerQuad, CASPER, 320 KB SRAM; 640 KB flash, USB HS,Flexcomm Interface, SDIO, 32-bit counter/ timers,SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC,Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG
Rev.1.9-10 February 2020
LPC55S1X NXP-LPC55S1X Datasheet
4Mb / 128P
32-bit Arm Cortex짰-M33, TrustZone, PRINCE, CASPER, 96 KB SRAM; 256 KB flash, USB HS, Flexcomm Interface, CAN FD, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 2.0 Msamples/sec ADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG
Rev. 1.2-8 June 2020
LPC55S2X NXP-LPC55S2X Datasheet
4Mb / 126P
32-bit Arm Cortex짰-M33, CASPER, 256 KB SRAM; 512 KB flash, USB HS, Flexcomm Interface, SDIO, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG
Rev. 1.8-4 March 2020
LPC55S0X NXP-LPC55S0X Datasheet
3Mb / 116P
32-bit Arm Cortex짰-M33, TrustZone, PRINCE, CASPER, 96 KB SRAM; 256 KB flash, Flexcomm Interface, CAN FD, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 2.0 Msamples/sec ADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG
Rev. 1.0-16 October 2020
LPC55S0X NXP-LPC55S0X_V01 Datasheet
2Mb / 118P
32-bit Arm Cortex짰-M33, TrustZone, PRINCE, CASPER, 96 KB SRAM; 256 KB flash, Flexcomm Interface, CAN FD, 32-bitcounter/ timers, SCTimer/PWM, PLU, 16-bit 2.0 Msamples/secADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC,RNG
Rev. 1.2-6 August 2021
LPC55S1X NXP-LPC55S1X_V01 Datasheet
3Mb / 132P
32-bit Arm Cortex짰-M33, TrustZone, PRINCE, CASPER, 96 KB SRAM; 256 KB flash, USB HS, Flexcomm Interface, CAN FD, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 2.0
Rev. 1.6-6 August 2021
LPC55S2X NXP-LPC55S2X_V01 Datasheet
3Mb / 132P
32-bit Arm Cortex짰-M33, CASPER, 256 KB SRAM; 512 KB flash, USB HS, Flexcomm Interface, SDIO, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG
Rev. 2.1-6 August 2021
LPC55S2X NXP-LPC55S2X_V02 Datasheet
3Mb / 140P
32-bit Arm Cortex®-M33, CASPER, 256 KB SRAM; 512 KB flash, USB HS, Flexcomm Interface, SDIO, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG
Rev. 2.2 - 8 December 2022
LPC55S6X NXP-LPC55S6X_V02 Datasheet
3Mb / 140P
32-bit Arm Cortex®-M33; M33 coprocessor, TrustZone, PowerQuad, CASPER, 320 KB SRAM; 640 KB flash, USB HS, Flexcomm Interface, SDIO, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 1.0 Msamples/sec ADC, Comparator,...
Rev. 2.4 - 8 December 2022
LPC55S0X NXP-LPC55S0X_V02 Datasheet
2Mb / 119P
32-bit Arm Cortex®-M33, TrustZone, PRINCE, CASPER, 96 KB SRAM; 256 KB flash, Flexcomm Interface, CAN FD, 32-bit counter/ timers, SCTimer/PWM, PLU, 16-bit 2.0 Msamples/sec ADC, Comparator, Temperature Sensor, AES, PUF, SHA, CRC, RNG
Rev. 1.3 - 3 February 2023
More results




About NXP Semiconductors


NXP Semiconductors is a publicly traded multinational company that designs, develops, and manufactures a wide range of semiconductors and integrated circuits for various applications, including automotive, industrial, communications, and consumer markets.

The company was founded in 2006 and is headquartered in Eindhoven, Netherlands.

NXP offers a broad portfolio of products, including microcontrollers, microprocessors, secure authentication ICs, power management ICs, RF and microwave components, and sensor solutions, among others.

The company's products are designed to be energy efficient, secure, and reliable, and are used in a variety of applications, including automotive systems, industrial automation and control, smart homes and buildings, and connected devices.

NXP is dedicated to innovation and customer satisfaction, and is committed to providing its customers with the best semiconductor solutions to meet their needs.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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