DESCRIPTION
The
SMF x xx is available in SOD 123FL Pa ckage.

FEATURES
 For surface mounted applications in order to
optimize board space.
 Low profile package
 Glass passivated junction
 Low inductance
 Plastic package has Underwriters Laboratory
Flamma
bility
 Availabl e in SOD 123FL P ackage

MECHANICAL DATA
Case: SOD
123FL
Ter
minals: Solderable per MIL STD 750,
Method 2026
Approx. Weight:15mg 0.00048oz