The **ATS-55150R-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed specifically for high-velocity airflow environments to cool electronic components like CPUs, GPUs, or high-power ASICs. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 2.50 °C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 15.00mm x 15.00mm x 19.50mm | | **Fin Style** | Straight-Fin (maxiFLOW™ Pattern) | | **Compliance** | RoHS Compliant | --- ### Key Design Components #### 1. maxiFLOW™ Fin Geometry Unlike standard square-cut fins, the maxiFLOW™ design features a flared fin structure. This increases the surface area available for heat dissipation while reducing pressure drop, making it highly efficient when paired with high-speed fans. #### 2. pushPIN™ Attachment System The part uses a **pushPIN™** mechanism which consists of: * **Plastic/Brass Pins:** To secure the heat sink to the PCB. * **Compression Springs:** To ensure consistent and precise pressure on the component (TIM), maximizing heat transfer. * **Pre-drilled Holes:** Required on the PCB for installation. #### 3. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that the unit comes with a **pre-applied Thermal Interface Material**. This eliminates the need for manual application of thermal paste, ensuring a uniform layer between the component and the heat sink base. --- ### Application Context This specific heat sink is "low-profile" in terms of footprint (15mm x 15mm) but relatively tall (19.5mm). It is commonly found in: * **Telecommunications:** Cooling small but high-heat network processors. * **Embedded Systems:** For industrial PCs where space is tight but airflow is managed. * **Power Supplies:** Cooling discrete power MOSFETs.