## Technical Overview: ATS-50190P-C2-R0 The **ATS-50190P-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** product line, which is specifically designed for high-density electronic cooling where airflow is constrained or restricted. --- ### 1. Key Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 19.0 mm x 19.0 mm x 17.5 mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.70 °C/W (Unducted Flow @ 200 LFM) | | **Equivalent Airflow** | High-performance tapered fin design | | **RoHS Status** | Compliant | --- ### 2. Design and Engineering Features The ATS-50190P-C2-R0 incorporates several specific engineering choices to maximize heat dissipation: #### A. maxiFLOW™ Geometry The fins are designed with a **tapered profile**. This increases the surface area for heat dissipation while maintaining a low pressure drop. This is crucial for electronic enclosures where high-speed fans are not feasible. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this model uses a **pushPIN™** system: * **Precision:** Provides consistent pressure on the processor or component. * **Security:** Uses a brass or plastic pin with a high-compression spring to ensure the heat sink does not move during vibration or shipping. * **Reliability:** Reduces the risk of "dry out" associated with thermal interface materials (TIMs) because of the constant downward force. #### C. Thermal Interface Material (TIM) Usually, these parts come pre-applied with a high-performance thermal phase-change material or grease (like **ATS-527**), ensuring there are no air gaps between the semiconductor and the heat sink. --- ### 3. Common Applications This specific small-form-factor heat sink is typically found in: * **Network Switches:** Cooling ASICs and high-speed processors. * **Telecommunications:** Base station hardware and signal processing units. * **Embedded Systems:** Industrial PCs and FPGA cooling where space is limited. --- ### 4. Comparison to Similar Parts | Part Number | Fin Height | Attachment Type | | :--- | :--- | :--- | | ATS-50190P-C1-R0 | 17.5 mm | Clip-on / Tape | | **ATS-50190P-C2-R0** | **17.5 mm** | **pushPIN™** | | ATS-50190B-C1-R0 | 7.5 mm | Low Profile |