The **ASPI-2012-R68M-T** is a surface-mount (SMD) power inductor manufactured by Abracon. It is designed for compact electronic circuits that require high efficiency and low electromagnetic interference (EMI). ### 1. Part Number Breakdown Understanding the nomenclature helps identify the component's specifications: | Segment | Meaning | Value | | :--- | :--- | :--- | | **ASPI** | Series Name | Abracon Surface Power Inductor | | **2012** | Dimensions | Approx. 2.0mm x 1.25mm | | **R68** | Inductance Value | 0.68 µH (Microhenries) | | **M** | Tolerance | ±20% | | **T** | Packaging | Tape & Reel | --- ### 2. Technical Specifications The following table highlights the core electrical and physical characteristics: | Parameter | Specification | | :--- | :--- | | **Inductance** | 0.68 µH | | **DC Resistance (DCR)** | ~55 mΩ (Max) | | **Saturation Current (Isat)** | ~2.5 A (Typical) | | **Temperature Rise Current (Irms)** | ~2.1 A (Typical) | | **Operating Temperature** | -40°C to +125°C | | **Shielding** | Magnetically Shielded | --- ### 3. Key Features & Construction * **Magnetically Shielded:** The part is constructed to contain the magnetic field, which prevents interference with nearby sensitive components on the PCB. * **Low Profile:** With a height of approximately 1.0mm to 1.2mm, it is ideal for thin consumer electronics like smartphones and tablets. * **Metal Alloy Core:** This series typically uses a metal powder core which offers higher saturation currents compared to traditional ferrite cores. * **High Efficiency:** Low DC resistance (DCR) minimizes power loss as heat. --- ### 4. Common Applications This inductor is primarily used in DC-DC conversion circuits where space is limited: 1. **Mobile Devices:** Power management for smartphones, wearables, and tablets. 2. **Point of Load (POL):** Localized voltage regulation on motherboards. 3. **IoT Modules:** Compact wireless sensors requiring efficient battery management. 4. **SSD/Storage:** Power rails for high-speed data drives. --- ### 5. Soldering & Footprint The **2012** size corresponds to the metric system (roughly **0805** in imperial units). When designing a PCB, ensure the land pattern accounts for the side terminals to ensure a robust solder joint during reflow. ```markdown Recommended Land Pattern (Approximate): - Pad Width: 1.25 mm - Pad Length: 0.70 mm - Gap between pads: 0.80 mm ``` ---