Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
0015800163
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800165
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating,
|
0015800165
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800169
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
0015800169
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800181
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
|
0015800181
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800183
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits
|
0015800183
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800185
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
0015800185
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800187
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
|
0015800187
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800189
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
0015800189
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800201
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
|
0015800201
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800203
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
0015800203
|
33Kb/2P |
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,
|
0015800205
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|