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01580 Datasheet, PDF

Search Partnumber : Included a word "01580" - Total : 253 ( 1/13 Page)
ManufacturerPart No.DatasheetDescription
Molex Electronics Ltd.
Molex Electronics Ltd.
0015800061 MOLEX2-0015800061 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
0015800063 MOLEX2-0015800063 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
0015800065 MOLEX2-0015800065 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
0015800067 MOLEX2-0015800067 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
0015800069 MOLEX2-0015800069 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
0015800081 MOLEX2-0015800081 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
0015800083 MOLEX2-0015800083 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
0015800085 MOLEX2-0015800085 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
0015800087 MOLEX2-0015800087 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
0015800089 MOLEX2-0015800089 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
0015800101 MOLEX2-0015800101 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
0015800103 MOLEX2-0015800103 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical Shrouded, High Temperature, 10 Circuits
0015800105 MOLEX2-0015800105 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
0015800107 MOLEX2-0015800107 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
0015800109 MOLEX2-0015800109 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
0015800121 MOLEX2-0015800121 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
0015800123 MOLEX2-0015800123 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
0015800125 MOLEX2-0015800125 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
0015800129 MOLEX2-0015800129 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
0015800141 MOLEX2-0015800141 Datasheet
1Mb / 7P
   2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating

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