Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
0008500189
|
161Kb/3P
|
Trifurcon??Crimp Terminal 6838, 18-20 AWG, Bag, Brass Tin (Sn)
|
0014600181
|
160Kb/3P
|
2.54mm (.100") Pitch SL??Insulation Displacement Connector Assembly, Female,Single Row, Version A, Nonpolarized, Wire Size 24, 3.81關m (150關") Tin/Lead (SnPb),18 Circuits
|
0014600182
|
174Kb/3P
|
2.54mm (.100") Pitch SL??Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 24, 3.81關m (150關") Tin/Lead (SnPb),18 Circuits
|
0014600183
|
162Kb/3P
|
2.54mm (.100") Pitch SL??Insulation Displacement Connector Assembly, Female, Single Row, Version A, Nonpolarized, Wire Size 26, 3.81關m (150關") Tin/Lead (SnPb),
|
0014600184
|
176Kb/3P
|
2.54mm (.100") Pitch SL??Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 26, 3.81關m (150關") Tin/Lead (SnPb),18 Circuits
|
0014600185
|
162Kb/3P
|
2.54mm (.100") Pitch SL??Insulation Displacement Connector Assembly, Female, Single Row, Version A, Nonpolarized, Wire Size 28, 3.81關m (150關") Tin/Lead (SnPb), 18 Circuits
|
0014600186
|
176Kb/3P
|
2.54mm (.100") Pitch SL??Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 28, 3.81關m (150關") Tin/Lead (SnPb)
|
0014600187
|
172Kb/3P
|
2.54mm (.100") Pitch SL??Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 24, 3.81關m (150關") Tin/Lead (SnPb)
|
0014600188
|
171Kb/3P
|
2.54mm (.100") Pitch SL??Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 24, 3.81關m (150關") Tin/Lead (SnPb)
|
0014600189
|
173Kb/3P
|
2.54mm (.100") Pitch SL??Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 26, 3.81關m (150關") Tin/Lead (SnPb)
|
0015800181
|
1Mb/7P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
|
0015800181
|
33Kb/2P
|
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800183
|
1Mb/7P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits
|
0015800183
|
33Kb/2P
|
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800185
|
1Mb/7P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
0015800185
|
33Kb/2P
|
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800187
|
1Mb/7P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
|
0015800187
|
33Kb/2P
|
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
0015800189
|
1Mb/7P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
0015800189
|
33Kb/2P
|
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
|
|