SN74LVC1G86

SINGLE 2-INPUT EXCLUSIVE-OR GATE

SCES222K – APRIL 1999 – REVISED SEPTEMBER 2003

1

POST OFFICE BOX 655303

NanoStar

 and NanoFree Packages

Operation

JESD 78, Class II

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

description/ordering information

The SN74LVC1G86 performs the Boolean function Y = A

⊕ B or Y = AB + AB in positive logic.

A common application is as a true/complement element. If the input is low, the other input is reproduced in true

form at the output. If the input is high, the signal on the other input is reproduced inverted at the output.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

–40 C to 85 C

NanoStar

 – WCSP (DSBGA)

0.17-mm Small Bump – YEA

Reel of 3000

SN74LVC1G86YEAR

_ _ _CH_

–40 C to 85 C

NanoFree

 – WCSP (DSBGA)

0.17-mm Small Bump – YZA (Pb-free)

Reel of 3000

SN74LVC1G86YZAR

_ _ _CH_

–40 C to 85 C

NanoStar

 – WCSP (DSBGA)

0.23-mm Large Bump – YEP

Reel of 3000

SN74LVC1G86YEPR

_ _ _CH_

–40

°C to 85°C

NanoFree

 – WCSP (DSBGA)

0.23-mm Large Bump – YZP (Pb-free)

SN74LVC1G86YZPR

SOT (SOT-23) – DBV

Reel of 3000

SN74LVC1G86DBVR

C86_

SOT (SOT-23) – DBV

Reel of 250

SN74LVC1G86DBVT

C86_

SOT (SC-70) – DCK

Reel of 3000

SN74LVC1G86DCKR

CH_

SOT (SC-70) – DCK

Reel of 250

SN74LVC1G86DCKT

CH_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,

and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

Copyright

 2003, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar and NanoFree are trademarks of Texas Instruments.

DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

5

4

A

B

GND

Y

3

2

1

4

5

GND

B

A

Y

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.