AD9432

Rev. F | Page 7 of 16

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

52 51

50 49 48 47 46 45 44 43 42 41 40

38

GND

37

36

33

GND

34

GND

35

GND

39

GND

32

31

DGND

30

D0 (LSB)

28

D2

27

D3

29

D1

2

3

GND

4

GND

7

ENCODE

6

5

1

GND

8

ENCODE

9

GND

10

12

DGND

13

11

GND

NOTES

1. DNC = DO NOT CONNECT.

14

15 16 17 18 19 20

21 22 23 24 25 26

PIN 1

AD9432

TOP VIEW

(Not to Scale)

PIN 1

AD9432

TOP VIEW

(Not to Scale)

1

GND

2

3

GND

4

GND

5

6

7

ENCODE

8

ENCODE

9

GND

10

11

GND

12

DGND

13

14 15

16 17

18 19

20 21

22 23 24 25 26

40

41

42

43

44

45

46

47

48

49

50

51

52

27

D3

28

D2

29

D1

30

D0 (LSB)

31

DGND

32

33

GND

34

GND

35

GND

36

37

38

GND

39

GND

NOTES

1. ALTHOUGH NOT REQUIRED IN ALL APPLICATIONS, THE EXPOSED PADDLE

ON THE UNDERSIDE OF THE PACKAGE SHOULD BE SOLDERED TO THE

GROUND PLANE. SOLDERING THE EXPOSED PADDLE TO THE PCB

INCREASES THE RELIABILITY OF THE SOLDER JOINTS, MAXIMIZING

THE THERMAL CAPABILITY OF THE PACKAGE.

Figure 3. Pin Configuration, LQFP

Figure 4. Pin Configuration, TQFP_EP

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 3, 4, 9, 11, 33,

34, 35, 38, 39, 40,

43, 48, 51

GND

Analog Ground.

2, 5, 6, 10, 36, 37,

42, 44, 47, 52

Analog Supply (5 V).

7

ENCODE

Encode Clock for ADC, Complementary.

8

ENCODE

Encode Clock for ADC, True. ADC samples on rising edge of ENCODE.

12, 21, 24, 31

DGND

Digital Output Ground.

13, 22, 23, 32

Digital Output Power Supply (2.7 V to 3.6 V).

14

OR

Out-of-Range Output.

15 to 20, 25 to 30

D11 to D6, D5 to D0

Digital Output.

41

DNC

Do Not Connect.

45

VREFIN

Reference Input for ADC (2.5 V Typical). Bypass with 0.1 μF capacitor to ground.

46

VREFOUT

Internal Reference Output (2.5 V Typical).

49

AIN

Analog Input, True.

50

AIN

Analog Input, Complementary.

Exposed Pad

(TQFP_EP)

Although not required in all applications, the exposed paddle on the underside of the TQFP_EP

package should be soldered to the ground plane. Soldering the exposed paddle to the PCB

increases the reliability of the solder joints, maximizing the thermal capability of the package.