AD4000_17 datasheet(9/36 Pages) AD

Part #	AD4000

Description	Precision, Pseudo Differential, SAR ADCs

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Manufacturer	AD [Analog Devices]

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Data Sheet

AD4000/AD4004/AD4008

Rev. C | Page 9 of 36

ABSOLUTE MAXIMUM RATINGS

Note that the input overvoltage clamp cannot sustain the

overvoltage condition for an indefinite amount of time.

Table 5.

Parameter

Rating

Analog Inputs

IN+, IN− to GND1

−0.3 V to VREF + 0.4 V

or ±130 mA2

Supply Voltage

REF, VIO to GND

−0.3 V to +6.0 V

VDD to GND

−0.3 V to +2.1 V

VDD to VIO

−6 V to +2.4 V

Digital Inputs to GND

−0.3 V to VIO + 0.3 V

Digital Outputs to GND

−0.3 V to VIO + 0.3 V

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

Lead Temperature Soldering

260°C reflow as per

JEDEC J-STD-020

ESD Ratings

Human Body Model

4 kV

Machine Model

200 V

Field Induced Charged Device Model

1.25 kV

1

See the Analog Inputs section for an explanation of IN+ and IN−.

2

Current condition tested over a 10 ms time interval.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 6. Thermal Resistance

Package Type1

θJA2

θJC3

Unit

RM-10

147

38

°C/W

CP-10-9

114

33

°C/W

1

Test Condition 1: thermal impedance simulated values are based upon use

of 2S2P JEDEC PCB. See the Ordering Guide.

2

θJA is the natural convection junction-to-ambient thermal resistance

measured in a one cubic foot sealed enclosure.

3

θJC is the junction-to-case thermal resistance.

ESD CAUTION

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