TLV2455A datasheet(28/45 Pages) TI

Part #	TLV2455A

Description	FAMILY OF 23-UA 220-KHZ RAIL TO RAIL INPUT/ OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN

PDF	45 Pages

Scroll/Zoom	100%

Manufacturer	TI [Texas Instruments]

Direct Link	http://www.ti.com

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28 / 45 page

TLV2450, TLV2451, TLV2452, TLV2453, TLV2454, TLV2455, TLV245xA

FAMILY OF 23 µA 220kHz RAILTORAIL INPUT/OUTPUT

OPERATIONAL AMPLIFIERS WITH SHUTDOWN

SLOS218F − DECEMBER 1998 − REVISED JANUARY 2005

28

WWW.TI.COM

POST OFFICE BOX 1443

• HOUSTON, TEXAS 77251−1443

APPLICATION INFORMATION

general power dissipation considerations

For a given

θJA, the maximum power dissipation is shown in Figure 53 and is calculated by the following formula:

P

D +

T

MAX

–T

A

q

JA

Where:

PD

= Maximum power dissipation of TLV245x IC (watts)

TMAX = Absolute maximum junction temperature (150°C)

TA

= Free-ambient air temperature (

°C)

θJA = θJC + θCA

θJC = Thermal coefficient from junction to case

θCA = Thermal coefficient from case to ambient air (°C/W)

1

0.75

0.5

0

−55 −40 −25 −10 5

1.25

1.5

MAXIMUM POWER DISSIPATION

vs

FREE-AIR TEMPERATURE

1.75

20 35 50

0.25

TA − Free-Air Temperature − °C

2

65 80 95 110 125

MSOP Package

Low-K Test PCB

θJA = 260°C/W

TJ = 150°C

PDIP Package

Low-K Test PCB

θJA = 104°C/W

SOIC Package

Low-K Test PCB

θJA = 176°C/W

SOT-23 Package

Low-K Test PCB

θJA = 324°C/W

NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.

Figure 53. Maximum Power Dissipation vs Free-Air Temperature

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TLV2455A Datasheet(PDF) 28 Page - Texas Instruments

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