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BC548 Datasheet(PDF) 6 Page - Foshan Blue Rocket Electronics Co.,Ltd. |
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BC548 Datasheet(HTML) 6 Page - Foshan Blue Rocket Electronics Co.,Ltd. |
6 / 6 page BC548 Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 6 / 6 波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free) 说明: Note: 1 、预热温度 25~150℃,时间 60~90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 2 、峰值温度 255±5℃,时间持续为 5±0.5sec; 2.Peak Temp.:255 ±5℃, Duration:5±0.5sec. 3 、焊接制程冷却速度为 2~10℃/sec. 3. Cooling Speed: 2~10 ℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度:270±5℃ 时间:10±1 sec. Temp.:270±5℃ Time:10±1 sec 包装规格 / Packaging SPEC. 散件包装 / BULK Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit:mm3) Units/Bag 只 /袋 Bags/Inner Box 袋 /盒 Units/Inner Box 只 /盒 Inner Boxes/Outer Box 盒 /箱 Units/Outer Box 只 /箱 Bag 袋 Inner Box 盒 Outer Box 箱 TO-92 1,000 10 10,000 5 50,000 135×190 237×172×102 560×245×195 1,000 10 10,000 10 100,000 135×190 237×172×102 560×245×375 编带包装 / AMMO Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit:mm3) Units/tape 只 /纸带 Tape/Inner Box 纸带 /盒 Rows/Inner Box 纸带层 /盒 Inner Boxes/Outer Box 盒 /箱 Units/Outer Box 只 /箱 Inner Box 盒 Outer Box 箱 TO-92 3,000 1 120 10 30,000 328×230×42 小箱 480×346×235, 大箱 547×407×268 使用说明 / Notices |
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