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LM3253 Datasheet(PDF) 5 Page - Texas Instruments |
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LM3253 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 26 page LM3253 www.ti.com SNVS791Q – FEBRUARY 2012 – REVISED MAY 2013 OPERATING RATINGS (1) Input Voltage Range 2.7V to 5.5V Recommended Load Current 0A to 3.0A Junction Temperature (TJ) Range −30°C to +125°C Ambient Temperature (TA) Range (2) −30°C to +90°C (1) All voltages are with respect to the potential at the GND pins. The LM3253 is designed for mobile phone applications where turn-on after power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin LOW until the input voltage exceeds 2.7V. (2) In applications where high-power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). At higher power levels duty cycle usage is assumed to drop (i.e., max power 12.5% usage is assumed) for 2G mode. THERMAL PROPERTIES Junction-to-Ambient Thermal 50°C/W Resistance ( θJA), YFQ Package (1) (1) Junction-to-ambient thermal resistance ( θJA) is taken from thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM3253 |
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