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TPA3221 Datasheet(PDF) 6 Page - Texas Instruments |
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TPA3221 Datasheet(HTML) 6 Page - Texas Instruments |
6 / 39 page 6 TPA3221 SLASEE9 – JUNE 2017 www.ti.com Product Folder Links: TPA3221 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) VDD can be connected to a supply voltage between 5 V and PVDD. VDD can be connected directly to PVDD, but must not exceed PVDD voltage. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT PVDD Power-stage supply DC supply voltage 7 30 31.5 V VDD(1) Supply voltage for internal LDO regulator to supply GVDD and AVDD DC supply voltage 7 31.5 V External supply for VDD, GVDD and AVDD. Internal LDO bypassed DC supply voltage 4.5 5 5.5 V AVDD Supply voltage for analog circuits DC supply voltage 4.5 5 5.5 GVDD Supply voltage for gate-drive circuitry DC supply voltage 4.5 5 5.5 V RL(BTL) Load impedance Output filter inductance within recommended value range 2.7 4 Ω RL(PBTL) 1.6 3 LOUT(BTL) Output filter inductance Minimum output inductance at IOC 5 10 μH LOUT(PBTL) Output filter inductance, PBTL before the LC filter Minimum output inductance at IOC 5 10 Output filter inductance, PBTL after the LC filter Minimum output inductance at half IOC , each inductor 5 10 FPWM PWM frame rate selectable for AM interference avoidance; 1% Resistor tolerance Nominal 384 400 417 kHz AM1 422 440 458 AM2 480 500 520 R(FREQ_ADJ) PWM frame rate programming resistor Nominal; Master mode 9.9 10 10.1 k Ω AM1; Master mode 29.7 30 30.3 AM2; Master mode 49.5 50 50.5 CPVDD PVDD close decoupling capacitors 1.0 μF ROC Over-current programming resistor Resistor tolerance = 5% 22 30 k Ω ROC(LATCHED) Over-current programming resistor Resistor tolerance = 5% 47 64 k Ω V(FREQ_ADJ) Voltage on FREQ_ADJ pin for slave mode operation Slave Mode (Connect to AVDD) 5 V TJ Junction temperature 0 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) Thermal data are obtained with 85°C heat sink temperature using thermal compound with 0.7W/mK thermal conductivity and 2mil thickness. In this model heat sink temperature is considered to be the ambient temperature and only path for dissipation is to the heatsink. 7.4 Thermal Information THERMAL METRIC(1) TPA3221 UNIT DDV 44-PINS HTSSOP FIXED 85°C HEATSINK TEMPERATURE(2) RθJA Junction-to-ambient thermal resistance 2.8(2) °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.5 RθJB Junction-to-board thermal resistance n/a ψJT Junction-to-top characterization parameter 0.9 ψJB Junction-to-board characterization parameter n/a RθJC(bot) Junction-to-case (bottom) thermal resistance n/a |
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