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TPA3221 Datasheet(PDF) 31 Page - Texas Instruments

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Part # TPA3221
Description  100-W Stereo, 200-W Mono HD-Audio, Analog-Input, Class-D Amplifier
Download  39 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPA3221 Datasheet(HTML) 31 Page - Texas Instruments

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31
TPA3221
www.ti.com
SLASEE9 – JUNE 2017
Product Folder Links: TPA3221
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Copyright © 2017, Texas Instruments Incorporated
Power Supplies (continued)
11.1.4 BST Supply
TPA3221 has built-in bootstrap supply for each half bridge gate drive to supply the high side MOSFETs, only
requiring a single capacitor per half bridge. The capacitors are connected to each half bridge oputput, and are
arged by the GVDD supply via an internal diode while the PWM outputs are in low state. The high side gate drive
is supplied by the voltage across the BST capacitor while the output PWM is high. It is recomemnded to place
the BST capacitors close to the TPA3221 device, and to keep PCB routing traces at minimum length.
12 Layout
12.1 Layout Guidelines
Use an unbroken ground plane to have good low impedance and inductance return path to the power supply
for power and audio signals.
Maintain a contiguous ground plane from the ground pins to the PCB area surrounding the device for as
many of the ground pins as possible, since the ground pins are the best conductors of heat in the package.
PCB layout, audio performance and EMI are linked closely together.
Routing the audio input should be kept short and together with the accompanied audio source ground.
The small bypass capacitors on the PVDD lines of the DUT be placed as close the PVDD pins as possible.
A local ground area underneath the device is important to keep solid to minimize ground bounce.
Orient the passive component so that the narrow end of the passive component is facing the TPA3221
device, unless the area between two pads of a passive component is large enough to allow copper to flow in
between the two pads.
Avoid placing other heat producing components or structures near the TPA3221 device.
Avoid cutting off the flow of heat from the TPA3221 device to the surrounding ground areas with traces or via
strings, especially on output side of device.
Netlist for this printed circuit board is generated from the schematic in Figure 23.


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