6

LMR23630

SNVSAH2C – DECEMBER 2015 – REVISED JUNE 2017

www.ti.com

Product Folder Links: LMR23630

Submit Documentation Feedback

Copyright © 2015–2017, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

Operating Conditions ).

7.4 Thermal Information

DDA (8 PINS)

DRR (12 PINS)

UNIT

Junction-to-ambient thermal resistance

42.0

41.5

°C/W

Junction-to-top characterization parameter

5.9

0.3

°C/W

Junction-to-board characterization parameter

23.4

16.5

°C/W

Junction-to-case (top) thermal resistance

45.8

39.1

°C/W

Junction-to-case (bottom) thermal resistance

3.6

3.4

°C/W

Junction-to-board thermal resistance

23.4

16.3

°C/W

7.5 Electrical Characteristics

Minimum and maximum limits are specified through test, design or statistical correlation. Typical values represent the most

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

POWER SUPPLY (VIN PIN)

Operation input voltage

HSOIC package

4.5

36

V

WSON package

4

36

VIN_UVLO

Undervoltage lockout thresholds

Rising threshold (HSOIC)

3.4

3.7

3.9

V

Falling hysteresis (HSOIC)

0.4

Rising threshold (WSON)

3.3

3.6

3.9

V

Falling threshold (WSON)

3

3.3

3.5

Shutdown supply current

to 125°C (HSOIC)

2

4

μA

125°C (WSON)

Operating quiescent current (non-

switching)

125°C, PFM mode

75

μA

ENABLE (EN PIN)

Enable rising threshold voltage

1.4

1.55

1.7

V

Enable hysteresis voltage

0.4

V

Wake-up threshold

0.4

V

Input leakage current at EN pin

10

100

nA

nA

1

μA

μA

VOLTAGE REFERENCE (FB PIN)

Reference voltage

0.985

1

1.015

V

(HSOIC)

0.98

1

1.02

V

(WSON)

Input leakage current at FB pin

10

nA