A

A

www.ti.com

PACKAGE OUTLINE

C

12X

0.3

0.2

2.5 0.1

2X

2.5

1.7 0.1

10X 0.5

0.8 MAX

12X

0.38

0.28

0.05

0.00

A

3.1

2.9

B

3.1

2.9

(0.2) TYP

(0.08)

(0.05)

WSON - 0.8 mm max height

DRR0012D

PLASTIC SMALL OUTLINE - NO LEAD

4223146/B 05/2017

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

6

7

12

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

C

THERMAL PAD

EXPOSED

13

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 4.000

SCALE 30.000

SECTION A-A

SECTION A-A

TYPICAL