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ICS93V850 Datasheet(PDF) 8 Page - Integrated Circuit Systems |
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ICS93V850 Datasheet(HTML) 8 Page - Integrated Circuit Systems |
8 / 8 page 8 ICS93V850 Preliminary Product Preview 0423H—07/03/03 Ordering Information ICS93V850yGT Designation for tape and reel packaging Pattern Number (2 or 3 digit number for parts with ROM code patterns) PackageType G = TSSOP Revision Designator (will not correlate with datasheet revision) Device Type Prefix ICS, AV = Standard Device Example: ICS XXXX y G - PPP - T INDEX AREA INDEX AREA 12 1 2 N D E1 E a SEATING PLANE SEATING PLANE A1 A A2 e -C- - C - b c L aaa C 6.10 mm. Body, 0.50 mm. pitch TSSOP (240 mil) (20 mil) MIN MAX MIN MAX A -- 1.20 -- .047 A1 0.05 0.15 .002 .006 A2 0.80 1.05 .032 .041 b 0.17 0.27 .007 .011 c 0.09 0.20 .0035 .008 D E E1 6.00 6.20 .236 .244 e L 0.45 0.75 .018 .030 N α 0° 8° 0° 8° aaa -- 0.10 -- .004 VARIATIONS MIN MAX MIN MAX 48 12.40 12.60 .488 .496 10-0039 N D mm. D (inch) Ref erence Doc.: JEDEC Publicat ion 95, M O-153 0.50 BASIC 0.020 BASIC SEE VARIATIONS SEE VARIATIONS SEE VARIATIONS SEE VARIATIONS 8.10 BASIC 0.319 BASIC SYMBOL In Millimeters In Inches COMMON DIMENSIONS COMMON DIMENSIONS |
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