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ACPL-785E Datasheet(PDF) 14 Page - Broadcom Corporation. |
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ACPL-785E Datasheet(HTML) 14 Page - Broadcom Corporation. |
14 / 16 page ![]() Broadcom - 14 - ACPL-785E, HCPL-7850, HCPL-7851, 5962-97557 Data Sheet Shunt Resistor Selections Shunt Resistor Selections The current-sensing shunt resistor should have low resistance (to minimize power dissipation), low inductance (to minimize di/dt induced voltage spikes that could adversely affect operation), and reasonable tolerance (to maintain overall circuit accuracy). The value of the shunt should be chosen as a compromise between minimizing power dissipation by making the shunt resistance smaller and improving circuit accuracy by making it larger and utilizing the full input range of the HCPL-785x. Broadcom recommends four different shunts that can be used to sense average currents in motor drives up to 35A and 35 hp. Table 1 shows the maximum current and horsepower range for each of the LVR-series shunts from Dale. Even higher currents can be sensed with lower value shunts available from vendors such as Dale, IRC, and Isotek (Isabellenhuette). When sensing currents large enough to cause significant heating of the shunt, the temperature coefficient of the shunt can introduce nonlinearity due to the signal dependent temperature rise of the shunt. Using a heat sink for the shunt or using a shunt with a lower tempco can help minimize this effect. The Application Note 1078, Designing with Avago Technologies Isolation Amplifiers, contains additional information on designing with current shunts. The recommended method for connecting the isolation amplifier to the shunt resistor is shown in Figure 24. Pin 2 (VIN+) is connected to the positive terminal of the shunt resistor, while pin 3 (VIN–) is shorted to pin 4 (GND1), with the power-supply return path functioning as the sense line to the negative terminal of the current shunt. This allows a single pair of wires or PC board traces to connect the isolation amplifier circuit to the shunt resistor. In some applications, however, supply currents flowing through the power-supply return path may cause offset or noise problems. In this case, better performance may be obtained by connecting pin 3 to the negative terminal of the shunt resistor separate from the power supply return path. When connected this way, both input pins should be bypassed. Whether two or three wires are used, it is recommended that twisted-pair wire or very close PC board traces be used to connect the current shunt to the isolation amplifier circuit to minimize electromagnetic interference to the sense signal. The 68Ω resistor in series with the input lead forms a low-pass anti-aliasing filter with the input bypass capacitor with a 200 kHz bandwidth. The resistor performs another important function as well: it dampens any ringing that might be present in the circuit formed by the shunt, the input bypass capacitor, and the wires or traces connecting the two. Undampened ringing of the input circuit near the input sampling frequency can alias into the baseband producing what might appear to be noise at the output of the device. To be effective, the damping resistor should be at least 39Ω. PC Board Layout In addition to affecting offset, the layout of the PC board can also affect the common-mode rejection (CMR) performance of the isolation amplifier, due primarily to stray capacitive coupling between the input and the output circuits. To obtain optimal CMR performance, the layout of the printed circuit board (PCB) should minimize any stray coupling by maintaining the maximum possible distance between the input and output sides of the circuit and ensuring that any ground plane on the PCB does not pass directly below the HCPL-785x. Using surface-mount components can help achieve many of the PCB objectives discussed in the preceding paragraphs. An example through-hole PCB layout illustrating some of the more important layout recommendations is shown in Figure 26 and Figure 27. See Application Note 1078, Designing with Avago Technologies Isolation Amplifiers, for more information on PCB layout consideration. Figure 28 Operating Circuit for Burn-In and Steady State Life Tests 1 2 3 4 8 7 6 5 VDD VIN+ VIN– GND VDD VOUT+ VOUT– GND + – + – 27 1 k 1 k 27 1 k 1 k (+) (–) VDD 5.5 VDC 0.1 F CONDITIONS: ICC = 17.5 mA TA = +125° C |
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