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TUSB8043 Datasheet(PDF) 9 Page - Texas Instruments |
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TUSB8043 Datasheet(HTML) 9 Page - Texas Instruments |
9 / 59 page ![]() 9 TUSB8043 www.ti.com SLLSEW4 – JUNE 2017 Product Folder Links: TUSB8043 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply Voltage Range VDD Steady-state supply voltage –0.3 1.4 V VDD33 Steady-state supply voltage –0.3 3.8 V Voltage Range USB_SSRXP_UP, USB_SSRXN_UP, USB_SSRXP_DN[4:1], USB_SSRXN_DP[4:1] and USB_VBUS terminals -0.3 1.4 V XI terminals -0.3 2.45 V All other terminals -0.3 3.8 V Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22- C101(2) ±500 (1) A 1.05-V, 1.1-V, or 1.2-V supply may be used as long as minimum and maximum supply conditions are met. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD(1) 1.1V supply voltage 0.99 1.1 1.26 V VDD33 3.3V supply voltage 3 3.3 3.6 V USB_VBUS Voltage at USB_VBUS PAD 0 1.155 V TA Operating free-air temperature TUSB8043 0 70 °C TJ Operating junction temperature –40 105 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) TUSB8043 UNIT RGC 64 PINS RθJA Junction-to-ambient thermal resistance 26 °C/W RθJCtop Junction-to-case (top) thermal resistance 11.5 °C/W RθJB Junction-to-board thermal resistance 5.3 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 5.2 °C/W RθJCbot Junction-to-case (bottom) thermal resistance 1.0 °C/W |
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