TS3USB221DRCRG4 datasheet(4/27 Pages) TI1

Part #	TS3USB221DRCRG4

Description	High-Speed USB 2.0 (480-Mbps) 1:2 Multiplexer ??Demultiplexer Switch With Single Enable

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Manufacturer	TI1 [Texas Instruments]

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TS3USB221

SCDS220I – NOVEMBER 2006 – REVISED JANUARY 2016

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

4.6

V

VIN

Control input voltage(2) (3)

–0.5

7

V

VI/O

Switch I/O voltage(2) (3) (4)

–0.5

7

V

IIK

Control input clamp current

VIN < 0

–50

mA

II/OK

I/O port clamp current

VI/O < 0

–50

mA

II/O

ON-state switch current(5)

±120

mA

Continuous current through VCC or GND

±100

mA

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(4)

VI and VO are used to denote specific conditions for VI/O.

(5)

II and IO are used to denote specific conditions for II/O.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

2000

V

6.3 Recommended Operating Conditions

See

(1).

MIN

MAX

UNIT

VCC

Supply voltage

2.3

3.6

V

VCC = 2.3 V to 2.7 V

VIH

High-level control input voltage

0.46 × VCC

VCC

V

VCC = 2.7 V to 3.6 V

VCC = 2.3 V to 2.7 V

VIL

Low-level control input voltage

0

0.25 × VCC

V

VCC = 2.7 V to 3.6 V

VI/O

Data input/output voltage

0

5.5

V

TA

Operating free-air temperature

–40

85

°C

(1)

All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

6.4 Thermal Information

TS3USB221

THERMAL METRIC(1)

DRC (VSON)

RSE (UQFN)

UNIT

10 PINS

RθJA

Junction-to-ambient thermal resistance

57.7

169.8

RθJC(top)

Junction-to-case (top) thermal resistance

87.7

84.7

RθJB

Junction-to-board thermal resistance

32.6

94.9

°C/W

ψJT

Junction-to-top characterization parameter

8.2

5.7

ψJB

Junction-to-board characterization parameter

32.8

94.9

RθJC(bot)

Junction-to-case (bottom) thermal resistance

18.5

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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