5

TPS61160, TPS61161

www.ti.com

SLVS791E – NOVEMBER 2007 – REVISED JULY 2016

Product Folder Links: TPS61160 TPS61161

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Copyright © 2007–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground pin.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

20

V

–0.3

20

V

–0.3

3

V

–0.3

40

V

Operating junction temperature

40

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±4000

V

±1000

(1)

These values are recommended values that have been successfully tested in several applications. Other values may be acceptable in

other applications but should be fully tested by the user.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Input voltage

2.7

18

V

Output voltage

38

V

L

10

22

μH

PWM dimming frequency

5

100

kHz

Minimum pulse width at PWM input

50

ns

Input capacitor

1

μF

0.47

10

μF

Operating ambient temperature

–40

85

°C

Operating junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

6.4 Thermal Information

TPS61160,

TPS61161

UNIT

DRV (WSON)

6 PINS

Junction-to-ambient thermal resistance

96.1

°C/W

Junction-to-case (top) thermal resistance

89

°C/W

Junction-to-board thermal resistance

65.9

°C/W

Junction-to-top characterization parameter

3.2

°C/W

Junction-to-board characterization parameter

66.3

°C/W

Junction-to-case (bottom) thermal resistance

40.8

°C/W