Copper

Trace Width

Solder Mask

Thickness

Solder

Pad Width

Solder Mask

Opening

Copper Trace

Thickness

20

TPA2012D2

SLOS438F – DECEMBER 2004 – REVISED MARCH 2017

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Copyright © 2004–2017, Texas Instruments Incorporated

Figure 39. Land Pattern Dimensions

12.1.2 Component Location

the TPA2012D2 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace

between the device and the capacitor can cause a loss in efficiency.

12.1.3 Trace Width

Recommended trace width at the solder balls is 75 µm to 100 µm to prevent solder wicking onto wider PCB

traces.

solder balls and at least 500-µm PCB traces to ensure proper performance and output power for the device.

For the remaining signals of the TPA2012D2, use 75-µm to 100-µm trace widths at the solder balls. The audio

input pins (INR± and INL±) must run side-by-side to maximize common-mode noise cancellation.