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TPA2012D2RTJR Datasheet(PDF) 20 Page - Texas Instruments

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Part # TPA2012D2RTJR
Description  2.1-W/Channel Stereo Filter-Free Class-D Audio Power Amplifier
Download  33 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPA2012D2RTJR Datasheet(HTML) 20 Page - Texas Instruments

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Copper
Trace Width
Solder Mask
Thickness
Solder
Pad Width
Solder Mask
Opening
Copper Trace
Thickness
20
TPA2012D2
SLOS438F – DECEMBER 2004 – REVISED MARCH 2017
www.ti.com
Product Folder Links: TPA2012D2
Submit Documentation Feedback
Copyright © 2004–2017, Texas Instruments Incorporated
Figure 39. Land Pattern Dimensions
12.1.2 Component Location
Place all the external components very close to the TPA2012D2. Placing the decoupling capacitor, CS, close to
the TPA2012D2 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace
between the device and the capacitor can cause a loss in efficiency.
12.1.3 Trace Width
Recommended trace width at the solder balls is 75 µm to 100 µm to prevent solder wicking onto wider PCB
traces.
For high current pins (PVDD, PGND, and audio output pins) of the TPA2012D2, use 100-µm trace widths at the
solder balls and at least 500-µm PCB traces to ensure proper performance and output power for the device.
For the remaining signals of the TPA2012D2, use 75-µm to 100-µm trace widths at the solder balls. The audio
input pins (INR± and INL±) must run side-by-side to maximize common-mode noise cancellation.


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