W25Q16DVDAIG-TR datasheet(69/80 Pages) WINBOND

Part #	W25Q16DVDAIG-TR

Description	3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

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Manufacturer	WINBOND [Winbond]

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Publication Release Date: January 26, 2015

- 69 -

Revision J

9.

PACKAGE SPECIFICATION

9.1

8-Pin SOIC 150-mil (Package Code SN)

L

θ

c

D

A1

A

e

b

SEATING PLANE

Y

0.25

GAUGE PLANE

E

H

E

4

1

5

8

L

θ

c

D

A1

A

e

b

SEATING PLANE

Y

0.25

GAUGE PLANE

E

H

E

H

E

4

1

5

8

SYMBOL

MILLIMETERS

INCHES

Min

Max

Min

Max

A

1.35

1.75

0.053

0.069

A1

0.10

0.25

0.004

0.010

b

0.33

0.51

0.013

0.020

c

0.19

0.25

0.008

0.010

E(3)

3.80

4.00

0.150

0.157

D(3)

4.80

5.00

0.188

0.196

e(2)

1.27 BSC

0.050 BSC

HE

5.80

6.20

0.228

0.244

Y(4)

---

0.10

---

0.004

L

0.40

1.27

0.016

0.050

θ

0°

10°

0°

10°

Notes:

1. Controlling dimensions: millimeters, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.

4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.

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W25Q16DVDAIG-TR Datasheet(PDF) 69 Page - Winbond

W25Q16DVDAIG-TR Datasheet(HTML) 69 Page - Winbond

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