LMH0344

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SNLS233O – APRIL 2007 – REVISED JULY 2015

10.2 Layout Example

Figure 6 and Figure 7 demonstrates the LMH0344EVM PCB layout. Ground and supply relief under the return

loss passive components and pads reduces parasitic - improving return loss performance. Note in Figure 7 that

the five vias between the four solder paste squares do not have solder paste. This practice improves both

thermal performance and soldering during board assembly.

Figure 6. LMH0344EVM Top Etch Layout Example

Figure 7. LMH0344EVM Top Solder Paste Mask

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