LMH0344

SNLS233O – APRIL 2007 – REVISED JULY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

4

V

Input voltage (all inputs)

V

Junction temperature

125

°C

Lead temperature

(soldering 4 seconds)

260

°C

Storage temperature

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

±8000

Electrostatic discharge

±2000

V

Machine model (MM)

400

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±8000 V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.

6.3 Recommended Operating Conditions

MIN

TYP

MAX

UNIT

Supply Voltage

3.135

3.3

3.465

V

Input Coupling Capacitance

1

µF

AEC Capacitor (Connected between AEC+ and AEC-)

1

µF

Operating Free Air Temperature

−40

25

85

°C

6.4 Thermal Information

LMH0344

RUM (WQFN)

NYA (CS-BGA)

UNIT

16 PINS

25 BALL

Junction-to-ambient thermal resistance

40

58.1

°C/W

Junction-to-case (top) thermal resistance

4.5

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 DC Electrical Characteristics

over Supply Voltage and Operating Temperature ranges, unless otherwise specified

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Input Common-Mode Voltage

1.9

V

Input Voltage Swing (SDI, SDI)

720

800

950

V

(SDO, SDO)

Output Voltage Swing

100-

Ω load, differential

750

(1)

Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated

(2)

(3)

Specification is ensured by characterization.

(4)

This specification is for 1m cable only.

6

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